New 3-D interconnection technology for future wearable bioelectronics

Press/Media: Press / Media

Period	2019 Aug 20

Title	New 3-D interconnection technology for future wearable bioelectronics
Media name/outlet	Long Room.com
Country	United States
Date	19/8/20
URL	ct.moreover.com/?a=39986936628&p=1gw&v=1&x=FyxVNWkb6kU38snSlnAJCg
Persons	Jang-Ung Park