New 3D interconnection technology for future wearable bioelectronics

Media coverage

• Title	New 3D interconnection technology for future wearable bioelectronics
  Media name/outlet	Space Daily
  Country	Australia
  Date	19/8/19
  Persons	Jang-Ung Park

• Title	New 3D interconnection technology for future wearable bioelectronics
  Media name/outlet	Science Daily
  Country	United States
  Date	19/8/15
  URL	ct.moreover.com/?a=39953467980&p=1gw&v=1&x=kwy9PgzNEL4zCx4advxOog
  Persons	Jang-Ung Park

• Title	New 3D interconnection technology for future wearable bioelectronics
  Media name/outlet	Long Room.com
  Country	United States
  Date	19/8/15
  URL	ct.moreover.com/?a=39953707874&p=1gw&v=1&x=yIUgYtqcQZNtVjTyPBUakg
  Persons	Jang-Ung Park

• Title	New 3D interconnection technology for future wearable bioelectronics
  Media name/outlet	Alpha Galileo
  Country	United Kingdom
  Date	19/8/14
  URL	ct.moreover.com/?a=39950045201&p=1gw&v=1&x=qWGoclEPhvurKl5dLl8WvQ
  Persons	Jang-Ung Park