Media coverage
1
Media coverage
Title Samsung Electronics Granted Patent for Semiconductor Package and Board for Mounting the Same Media name/outlet Global IP News. Semiconductor Patent News Country India Date 20/9/29 Persons Hyun Jae Kim
Press/Media: Press / Media
Media coverage
Title | Samsung Electronics Granted Patent for Semiconductor Package and Board for Mounting the Same |
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Media name/outlet | Global IP News. Semiconductor Patent News |
Country | India |
Date | 20/9/29 |
Persons | Hyun Jae Kim |