Samsung Electronics Granted Patent for Semiconductor Package and Board for Mounting the Same

Press/Media: Press / Media

Period2020 Sep 29

Media coverage

1

Media coverage

  • TitleSamsung Electronics Granted Patent for Semiconductor Package and Board for Mounting the Same
    Media name/outletGlobal IP News. Semiconductor Patent News
    CountryIndia
    Date20/9/29
    PersonsHyun Jae Kim
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