Samsung Electronics Secures Patent on Method of Testing an Interconnection Substrate and Apparatus for Performing the Same

Press/Media: Press / Media

Period2021 Jun 29

Media coverage

1

Media coverage

  • TitleSamsung Electronics Secures Patent on Method of Testing an Interconnection Substrate and Apparatus for Performing the Same
    Media name/outletGlobal IP News. Semiconductor Patent News
    CountryIndia
    Date21/6/29
    PersonsHyun Jae Kim