Samsung Electronics Submits Korean Patent Application for Method of Testing an Interconnection Substrate and Apparatus for Performing the Same

Press/Media: Press / Media

Period2022 Jun 20

Media coverage

1

Media coverage

  • TitleSamsung Electronics Submits Korean Patent Application for Method of Testing an Interconnection Substrate and Apparatus for Performing the Same
    Media name/outletGlobal IP News. Measurement & Testing Patent News
    Country/TerritoryIndia
    Date22/6/20
    PersonsHyun Jae Kim
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