Samsung Electronics Submits Patent Application for Plasma Processing Apparatus and Method for Dechucking Wafer in the Plasma Processing Apparatus

Press/Media: Press / Media

Period2022 Mar 4

Media coverage

1

Media coverage

  • TitleSamsung Electronics Submits Patent Application for Plasma Processing Apparatus and Method for Dechucking Wafer in the Plasma Processing Apparatus
    Media name/outletGlobal IP News. Semiconductor Patent News
    Country/TerritoryIndia
    Date22/3/4
    PersonsHyun Jae Kim