Samsung Electronics Submits Patent Application for Semiconductor Device and Semiconductor Package Including the Semiconductor Device

Press/Media: Press / Media

Period2022 Jan 28

Media coverage

1

Media coverage

  • TitleSamsung Electronics Submits Patent Application for Semiconductor Device and Semiconductor Package Including the Semiconductor Device
    Media name/outletGlobal IP News. Semiconductor Patent News
    Country/TerritoryIndia
    Date22/1/28
    PersonsYong-Jun Kim