United States Patent for Multi-Layer Capacitor Package and Package Housing Issued to Research & Business Foundation Sungkyunkwan University

Press/Media: Press / Media

Period2018 Jun 20

Media coverage

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Media coverage

  • TitleUnited States Patent for Multi-Layer Capacitor Package and Package Housing Issued to Research & Business Foundation Sungkyunkwan University
    Media name/outletGlobal IP News. Electronics Patent News
    CountryIndia
    Date18/6/20
    PersonsJeong-Hoon Kim
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