United States Patent for Multi-Layer Capacitor Package and Package Housing Issued to Research & Business Foundation Sungkyunkwan University

Press/Media: Press / Media

Period2018 Jun 20

Media coverage

1

Media coverage

  • TitleUnited States Patent for Multi-Layer Capacitor Package and Package Housing Issued to Research & Business Foundation Sungkyunkwan University
    Media name/outletGlobal IP News. Electronics Patent News
    CountryIndia
    Date18/6/20
    PersonsJeong-Hoon Kim