US Patent Issued to CHEIL INDUSTRIES on March 22 for "Resist underlayer composition and method of manufacturing semiconductor integrated circuit device using the same" (South Korean Inventors)

Press/Media: Press / Media

Period2016 Apr 1

Media coverage

3

Media coverage

  • TitleUS Patent Issued to CHEIL INDUSTRIES on March 22 for "Resist underlayer composition and method of manufacturing semiconductor integrated circuit device using the same" (South Korean Inventors)
    Media name/outletUS Fed News
    Country/TerritoryUnited States
    Date16/4/1
    PersonsHyeon Mo Cho
  • TitleUS Patent Issued to CHEIL INDUSTRIES on March 22 for "Resist underlayer composition and method of manufacturing semiconductor integrated circuit device using the same" (South Korean Inventors)
    Media name/outletUS Fed News
    Country/TerritoryUnited States
    Date16/4/1
    PersonsHyeon Mo Cho
  • TitleUS Patent Issued to CHEIL INDUSTRIES on March 22 for "Resist underlayer composition and method of manufacturing semiconductor integrated circuit device using the same" (South Korean Inventors)
    Media name/outletUS Fed News
    Country/TerritoryUnited States
    Date16/4/1
    PersonsHyeon Mo Cho
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