US Patent Issued to ENDODERMA on March 29 for "Microstructure for transdermal absorption and method for manufacturing same" (South Korean Inventors)

Press/Media: Press / Media

Period2022 Mar 30

Media coverage

1

Media coverage

  • TitleUS Patent Issued to ENDODERMA on March 29 for "Microstructure for transdermal absorption and method for manufacturing same" (South Korean Inventors)
    Media name/outletUS Fed News
    Country/TerritoryUnited States
    Date22/3/30
    Personsjin woo Park
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