US Patent Issued to MagnaChip Semiconductor on March 29 for "Heat releasing semiconductor chip package and method for manufacturing the same" (South Korean Inventors)

Press/Media: Press / Media

Period2022 Mar 30

Media coverage

1

Media coverage

  • TitleUS Patent Issued to MagnaChip Semiconductor on March 29 for "Heat releasing semiconductor chip package and method for manufacturing the same" (South Korean Inventors)
    Media name/outletUS Fed News
    Country/TerritoryUnited States
    Date22/3/30
    Personsjin woo Park