US Patent Issued to SAMSUNG ELECTRO-MECHANICS on Feb. 28 for "Electronic component and board having the same mounted thereon" (South Korean Inventors)

Press/Media: Press / Media

Period	2023 Mar 1

Media coverage

Title	US Patent Issued to SAMSUNG ELECTRO-MECHANICS on Feb. 28 for "Electronic component and board having the same mounted thereon" (South Korean Inventors)
Media name/outlet	US Fed News
Country/Territory	United States
Date	23/3/1
URL	ct.moreover.com/?a=50135338049&p=1gw&v=1&x=Cmfh4fe9tkT_De_M2xYV3w
Persons	jin woo Park