US Patent Issued to SAMSUNG ELECTRO-MECHANICS on Oct. 4 for "Semiconductor package including frame in which semiconductor chip is embedded" (South Korean Inventors)

Press/Media: Press / Media

Period	2022 Oct 5

Media coverage

Title	US Patent Issued to SAMSUNG ELECTRO-MECHANICS on Oct. 4 for "Semiconductor package including frame in which semiconductor chip is embedded" (South Korean Inventors)
Media name/outlet	US Fed News
Country/Territory	United States
Date	22/10/5
URL	ct.moreover.com/?a=48915994471&p=1gw&v=1&x=0XNAVJgYaodQTjOicUIv8w
Persons	jin woo Park