US Patent Issued to SAMSUNG ELECTRONICS, DONGJIN SEMICHEM on April 19 for "Protective film composition and method of manufacturing semiconductor package by using the same" (South Korean Inventors)

Press/Media: Press / Media

Period2022 Apr 20

Media coverage

1

Media coverage

  • TitleUS Patent Issued to SAMSUNG ELECTRONICS, DONGJIN SEMICHEM on April 19 for "Protective film composition and method of manufacturing semiconductor package by using the same" (South Korean Inventors)
    Media name/outletUS Fed News
    Country/TerritoryUnited States
    Date22/4/20
    PersonsHyun Jae Kim