US Patent Issued to SAMSUNG ELECTRONICS, DONGJIN SEMICHEM on Dec. 1 for "Protective film composition and method of manufacturing semiconductor package by using the same" (South Korean Inventors)

Press/Media: Press / Media

Period2020 Dec 2

Media coverage

1

Media coverage

  • TitleUS Patent Issued to SAMSUNG ELECTRONICS, DONGJIN SEMICHEM on Dec. 1 for "Protective film composition and method of manufacturing semiconductor package by using the same" (South Korean Inventors)
    Media name/outletUS Fed News
    CountryUnited States
    Date20/12/2
    PersonsHyun Jae Kim