US Patent Issued to SAMSUNG ELECTRONICS, Industry-Academic Cooperation Foundation, Yonsei University on June 23 for "Hybrid composite film, method of fabricating the same, and integrated circuit device including hybrid composite film" (South Korean Invent

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Period2020 Jun 24

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  • TitleUS Patent Issued to SAMSUNG ELECTRONICS, Industry-Academic Cooperation Foundation, Yonsei University on June 23 for "Hybrid composite film, method of fabricating the same, and integrated circuit device including hybrid composite film" (South Korean Invent
    Media name/outletUS Fed News
    CountryUnited States
    Date20/6/24
    PersonsKangtaek Lee