US Patent Issued to SAMSUNG ELECTRONICS on April 21 for "Integrated circuit devices having through-silicon via structures" (South Korean Inventors)

Press/Media: Press / Media

Period2020 Apr 22

Media coverage

1

Media coverage

  • TitleUS Patent Issued to SAMSUNG ELECTRONICS on April 21 for "Integrated circuit devices having through-silicon via structures" (South Korean Inventors)
    Media name/outletUS Fed News
    Country/TerritoryUnited States
    Date20/4/22
    PersonsHyun Jae Kim
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