US Patent Issued to SAMSUNG ELECTRONICS on Dec. 13 for "Semiconductor package" (South Korean Inventors)

Press/Media: Press / Media

Period	2022 Dec 14

Media coverage

Title	US Patent Issued to SAMSUNG ELECTRONICS on Dec. 13 for "Semiconductor package" (South Korean Inventors)
Media name/outlet	US Fed News
Country/Territory	United States
Date	22/12/14
URL	ct.moreover.com/?a=49499308208&p=1gw&v=1&x=99gD5xT8JKNMzSTUDv0-UA
Persons	Sanghoon Lee