US Patent Issued to SAMSUNG ELECTRONICS on Dec. 22 for "Bonding head and method for bonding semiconductor package, and semiconductor package" (South Korean Inventors)

Press/Media: Press / Media

Period2020 Dec 23

Media coverage

1

Media coverage

  • TitleUS Patent Issued to SAMSUNG ELECTRONICS on Dec. 22 for "Bonding head and method for bonding semiconductor package, and semiconductor package" (South Korean Inventors)
    Media name/outletUS Fed News
    Country/TerritoryUnited States
    Date20/12/23
    PersonsSanghoon Lee
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