US Patent Issued to SAMSUNG ELECTRONICS on Dec. 27 for "Semiconductor device and semiconductor package including the semiconductor device" (South Korean Inventors)

Press/Media: Press / Media

Period	2022 Dec 28

Media coverage

Title	US Patent Issued to SAMSUNG ELECTRONICS on Dec. 27 for "Semiconductor device and semiconductor package including the semiconductor device" (South Korean Inventors)
Media name/outlet	US Fed News
Country/Territory	United States
Date	22/12/28
URL	ct.moreover.com/?a=49611406428&p=1gw&v=1&x=uZ6hhH8sdXo8tNbe1q4iuQ
Persons	Yong-Jun Kim