US Patent Issued to SAMSUNG ELECTRONICS on Dec. 27 for "Semiconductor package and method of fabricating the same" (South Korean Inventors)

Press/Media: Press / Media

Period	2022 Dec 28

Media coverage

Title	US Patent Issued to SAMSUNG ELECTRONICS on Dec. 27 for "Semiconductor package and method of fabricating the same" (South Korean Inventors)
Media name/outlet	US Fed News
Country/Territory	United States
Date	22/12/28
URL	ct.moreover.com/?a=49609360339&p=1gw&v=1&x=pXSb4VEgZtzg7aHK-YPhnw
Persons	jin woo Park