US Patent Issued to SAMSUNG ELECTRONICS on Dec. 8 for "Substrate assembly semiconductor package including the same and method of manufacturing the semiconductor package" (South Korean Inventors)

Press/Media: Press / Media

Period2020 Dec 9

Media coverage

1

Media coverage

  • TitleUS Patent Issued to SAMSUNG ELECTRONICS on Dec. 8 for "Substrate assembly semiconductor package including the same and method of manufacturing the semiconductor package" (South Korean Inventors)
    Media name/outletUS Fed News
    CountryUnited States
    Date20/12/9
    PersonsHyun Jae Kim