US Patent Issued to SAMSUNG ELECTRONICS on Feb. 22 for "Inspection system and method for inspecting semiconductor package, and method of fabricating semiconductor package" (South Korean Inventors)

Press/Media: Press / Media

Period2022 Feb 23

Media coverage

1

Media coverage

  • TitleUS Patent Issued to SAMSUNG ELECTRONICS on Feb. 22 for "Inspection system and method for inspecting semiconductor package, and method of fabricating semiconductor package" (South Korean Inventors)
    Media name/outletUS Fed News
    Country/TerritoryUnited States
    Date22/2/23
    PersonsHyun Jae Kim
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