US Patent Issued to SAMSUNG ELECTRONICS on Jan. 10 for "Apparatus and method of manufacturing solder bump" (South Korean Inventors)

Press/Media: Press / Media

Period	2023 Jan 22

Media coverage

Title	US Patent Issued to SAMSUNG ELECTRONICS on Jan. 10 for "Apparatus and method of manufacturing solder bump" (South Korean Inventors)
Media name/outlet	US Fed News
Country/Territory	United States
Date	23/1/22
URL	ct.moreover.com/?a=49812764541&p=1gw&v=1&x=TrLlhSfNr-de-nsW6P8kmw
Persons	Sanghoon Lee