US Patent Issued to SAMSUNG ELECTRONICS on Jan. 10 for "Packaged multi-chip semiconductor devices and methods of fabricating same" (South Korean Inventors)

Press/Media: Press / Media

Period	2023 Jan 23

Media coverage

Title	US Patent Issued to SAMSUNG ELECTRONICS on Jan. 10 for "Packaged multi-chip semiconductor devices and methods of fabricating same" (South Korean Inventors)
Media name/outlet	US Fed News
Country/Territory	United States
Date	23/1/23
URL	ct.moreover.com/?a=49815535097&p=1gw&v=1&x=i5eFSsqpNqBJ6V1PdiPq9g
Persons	Sanghoon Lee