US Patent Issued to SAMSUNG ELECTRONICS on July 14 for "Deformation measuring apparatus and method of evaluating deformation using thereof" (South Korean Inventors)

Press/Media: Press / Media

Period2020 Jul 15

Media coverage

1

Media coverage

  • TitleUS Patent Issued to SAMSUNG ELECTRONICS on July 14 for "Deformation measuring apparatus and method of evaluating deformation using thereof" (South Korean Inventors)
    Media name/outletUS Fed News
    CountryUnited States
    Date20/7/15
    PersonsYoung Hoon Lee