US Patent Issued to Samsung Electronics on June 28 for "Semiconductor package" (South Korean Inventors)

Press/Media: Press / Media

Period2022 Jun 29

Media coverage

1

Media coverage

  • TitleUS Patent Issued to Samsung Electronics on June 28 for "Semiconductor package" (South Korean Inventors)
    Media name/outletUS Fed News
    Country/TerritoryUnited States
    Date22/6/29
    Personsjin woo Park
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