US Patent Issued to SAMSUNG ELECTRONICS on June 29 for "Semiconductor device including a through contact extending between sub-chips and method of fabricating the same" (South Korean Inventors)

Press/Media: Press / Media

Period2021 Jul 1

Media coverage

1

Media coverage

  • TitleUS Patent Issued to SAMSUNG ELECTRONICS on June 29 for "Semiconductor device including a through contact extending between sub-chips and method of fabricating the same" (South Korean Inventors)
    Media name/outletUS Fed News
    Country/TerritoryUnited States
    Date21/7/1
    PersonsHyun Jae Kim