US Patent Issued to SAMSUNG ELECTRONICS on March 2 for "Semiconductor devices including stress-inducing layers and methods of forming the same" (South Korean Inventors)

Press/Media: Press / Media

Period2021 Mar 2

Media coverage

1

Media coverage

  • TitleUS Patent Issued to SAMSUNG ELECTRONICS on March 2 for "Semiconductor devices including stress-inducing layers and methods of forming the same" (South Korean Inventors)
    Media name/outletUS Fed News
    Country/TerritoryUnited States
    Date21/3/2
    PersonsHyun Jae Kim