US Patent Issued to SAMSUNG ELECTRONICS on March 2 for "Semiconductor devices including stress-inducing layers and methods of forming the same" (South Korean Inventors)

Media coverage

• Title	US Patent Issued to SAMSUNG ELECTRONICS on March 2 for "Semiconductor devices including stress-inducing layers and methods of forming the same" (South Korean Inventors)
  Media name/outlet	US Fed News
  Country/Territory	United States
  Date	21/3/2
  Persons	Hyun Jae Kim