US Patent Issued to SAMSUNG ELECTRONICS on May 3 for "Method for fabricating semiconductor package" (South Korean Inventors)

Press/Media: Press / Media

Period2022 May 4

Media coverage

1

Media coverage

  • TitleUS Patent Issued to SAMSUNG ELECTRONICS on May 3 for "Method for fabricating semiconductor package" (South Korean Inventors)
    Media name/outletUS Fed News
    Country/TerritoryUnited States
    Date22/5/4
    Personsjin woo Park