US Patent Issued to SAMSUNG ELECTRONICS on Nov. 8 for "Method of manufacturing semiconductor device having a structure pattern having a plurality of trenches" (South Korean Inventors)

Press/Media: Press / Media

Period	2022 Nov 9

Media coverage

Title	US Patent Issued to SAMSUNG ELECTRONICS on Nov. 8 for "Method of manufacturing semiconductor device having a structure pattern having a plurality of trenches" (South Korean Inventors)
Media name/outlet	US Fed News
Country/Territory	United States
Date	22/11/9
URL	ct.moreover.com/?a=49208244887&p=1gw&v=1&x=ze3HHkig7FOkVXZ3cvtLPA
Persons	jin woo Park