• 509 Citations
  • 12 h-Index
19962019
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Network

Koch, Tim

  • Hewlett-Packard
  • Hewlett-Packard Company

External person

Henze, Dick

  • Hewlett-Packard
  • Mobile and Immersive Experience Lab.

External person

Mabeck, Jeff

  • Hewlett-Packard
  • Hewlett-Packard Company

External person

Zhou, Zhang Lin

  • Hewlett-Packard
  • Mobile and Immersive Experience Lab.

External person

Lee, J. Y.

  • Yonsei University
  • School of Integrated Technology
  • Institute of Convergence

External person

Combs, Gregg

  • Hewlett-Packard
  • Hewlett-Packard Company

External person

Benson, Brad

  • Hewlett-Packard
  • Hewlett-Packard Company

External person

Lee, Jihye

  • Korea Institute of Machinery and Materials
  • Nanomechanical System Research Center
  • Department of Nano Manufacturing Technology
  • Yonsei University
  • School of Integrated Technology
  • Institute of Convergence
  • Chungnam National University
  • Department of Food Science and Technology

External person

Tan, Michael

  • Hewlett-Packard

External person

Mathai, Sagi

  • Hewlett-Packard

External person

Han, Jaehyun

  • Yonsei University
  • School of Integrated Technology
  • Institute of Convergence

External person

Kuo, Huei Pei

  • Hewlett-Packard

External person

Rosenberg, Paul

  • Hewlett-Packard

External person

Hoffman, Randy

  • Hewlett-Packard

External person

Liu, Qin

  • Hewlett-Packard
  • Hewlett-Packard Company

External person

Korthuis, Vincent

  • Hewlett-Packard

External person

Straznicky, Joseph

  • Hewlett-Packard

External person

McLaren, Moray

  • Hewlett-Packard

External person

Bicknell, R. N.

  • Hewlett-Packard

External person

Park, Jiyun

  • Yonsei University
  • School of Integrated Technology
  • Institute of Convergence

External person

Jeon, Yoocharn

  • Hewlett-Packard
  • Mobile and Immersive Experience Lab.

External person

Kornilovitch, P. E.

  • Hewlett-Packard

External person

Wang, Shih Yuan

  • Hewlett-Packard

External person

Morris, Terry

  • Hewlett-Packard

External person

Hesselink, L.

  • Stanford University
  • Ctr. for Nonlinear Optical Materials
  • Department of Electrical Engineering
  • Department of Applied Physics

External person

Huang, T. F.

  • Stanford University
  • Ctr. for Nonlinear Optical Materials

External person

Lam, Sity

  • Hewlett-Packard
  • Mobile and Immersive Experience Lab.

External person

Meyer, Neal

  • Hewlett-Packard

External person

Parent, Mary

  • Hewlett-Packard
  • Mobile and Immersive Experience Lab.

External person

King, L.

  • Hewlett-Packard

External person

Jouppi, Norman P.

  • Hewlett-Packard

External person

Yang, June

  • Hewlett-Packard
  • Mobile and Immersive Experience Lab.

External person

Jeon, Deok Jin

  • Yonsei University
  • School of Integrated Technology
  • Institute of Convergence

External person

Harris, J. S.

  • Stanford University
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering

External person

Pechook, S.

  • Technion-Israel Institute of Technology
  • Department of Materials Science and Engineering
  • Russell Berrie Nanotechnology Institute

External person

Lerner, Scott

  • Hewlett-Packard

External person

Kim, Jeong Hyeon

  • Yonsei University
  • School of Integrated Technology
  • Institute of Convergence

External person

Mack, Wayne

  • Hewlett-Packard

External person

Otis, Charles

  • Hewlett-Packard

External person

Seals, Lenward

  • Hewlett-Packard

External person

Mendoza, Plary

  • Hewlett-Packard

External person

Emery, Tim

  • Hewlett-Packard

External person

Delos-Reyes, Mike

  • Hewlett-Packard

External person

Kiyama, Lennie

  • Hewlett-Packard

External person

Hill, Don

  • Hewlett-Packard

External person

Pokroy, B.

  • Technion-Israel Institute of Technology
  • Department of Materials Science and Engineering
  • Russell Berrie Nanotechnology Institute

External person

Stellbrink, Joe

  • Hewlett-Packard

External person

Lee, Su Bong

  • Yonsei University
  • School of Integrated Technology

External person

Yeon, Deuk Ho

  • Yonsei University
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science
  • LG Corporation

External person

Klemmed, Benjamin

  • Physical Chemistry
  • Technische Universität Dresden

External person

Lee, Kyoungho

  • Soonchunhyang University
  • Department of Display Materials Engineering

External person

Jackson, Warren

  • Hewlett-Packard

External person

Ji, Seungmuk

  • Yonsei University
  • Institute of Convergence

External person

Balakin, Sascha

  • Institute for Materials Science and Max Bergmann Center of Biomaterials
  • Technische Universität Dresden
  • Fraunhofer Institute for Ceramic Technologies and Systems

External person

Lee, Jung Shin

  • Yonsei University
  • School of Mechanical Engineering
  • Mechanical Engineering
  • Department of Mechanical Engineering

External person

Lee, Taeksu

  • Yonsei University
  • Korea Institute of Machinery and Materials
  • Department of Chemical and Biomolecular Engineering
  • Nano-Mechanical Systems Research Center
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemical Engineering

External person

Youden, K. E.

  • Stanford University

External person

Yang, Jun

  • Hewlett-Packard

External person

Lewis, Henry

  • Hewlett-Packard

External person

Opitz, Joerg

  • Fraunhofer Institute for Ceramic Technologies and Systems
  • Institute for Materials Science and Max Bergmann Center of Biomaterials
  • Technische Universität Dresden

External person

Kwon, Oh Hyeon

  • Yonsei University
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science

External person

Cuniberti, Gianaurelio

  • Institute for Materials Science and Max Bergmann Center of Biomaterials
  • Technische Universität Dresden

External person

Heikenfeld, Jason

  • University of Cincinnati

External person

Kornilovich, Pavel

  • Hewlett-Packard

External person

Missirlis, Athanassios

  • Fraunhofer Institute for Ceramic Technologies and Systems

External person

Akella, A.

  • Stanford University
  • Ctr. for Nonlinear Optical Materials

External person

Kwon, Heemin

  • Yonsei University

External person

Tuncel, E.

  • Stanford University

External person

Drzaic, Paul

  • Drzaic Consulting Services

External person

Yoon, Hong Min

  • Yonsei University
  • Department of Mechanical Engineering
  • School of Mechanical Engineering
  • Mechatronics Center
  • Samsung

External person

Choe, Jeongun

  • Yonsei University
  • School of Integrated Technology
  • Institute of Convergence

External person

Mohanty, B. C.

  • Yonsei University
  • Thapar University
  • School of Physics and Materials Science
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science

External person

Park, Sang Heon

  • Yonsei University
  • School of Integrated Technology
  • Institute of Convergence

External person

Bang, Doyeon

  • Yonsei University
  • Department of Chemical and Biomolecular Engineering
  • Active Polymer Center for Pattern Integration (APCPI)
  • Department of Chemical Engineering
  • Nanomedical Graduate Program
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemical and Bimolecular Engineering

External person

Chang, Young Wook

  • Yonsei University
  • Department of Physics
  • Department of Physics
  • Department of Materials Science and Engineering
  • Nanomedical Graduate Program

External person

Park, Joseph

  • Yonsei University
  • Harvard University
  • Department of Chemical and Biomolecular Engineering
  • Dept. of Chem. and Chemical Biology
  • Department of Chemical Engineering
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemical Engineering
  • Department of Chemical and Bimolecular Engineering
  • Department of Chemical and Biomolecular Engineering

External person

Elder, Richard

  • Hewlett-Packard

External person