• Source: Scopus
  • Calculated based on no. of publications stored in Pure and citations from Scopus
1991 …2021

Research output per year

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  • 2015

    The influence of electrode on sensitivity of pH sensors fabricated on AlGaN/GaN Heterostructures

    Lee, C. T., Jung, S. M. & Shin, M. W., 2015, NSTI: Biotech, Biomaterials and Biomedical - TechConnect Briefs 2015. Laudon, M. & Romanowicz, B. (eds.). Taylor and Francis Inc., p. 159-161 3 p. (NSTI: Advanced Materials - TechConnect Briefs 2015; vol. 3).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • Thermal conductivity model for Polymer/Boron Nitride nanocomposite considering air void content

    Park, S. Y., Kim, J. H. & Shin, M. W., 2015, NSTI: Advanced Materials - TechConnect Briefs 2015. Romanowicz, B. & Laudon, M. (eds.). Taylor and Francis Inc., p. 372-375 4 p. (NSTI: Advanced Materials - TechConnect Briefs 2015; vol. 1).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • 2012

    Development and performance of LED metal package with an integrated reflector/heat slug structure

    Kim, J. H., Choi, J. H., Mun, S. H. & Shin, M. W., 2012, 18th International Workshop on Thermal Investigation of ICs and Systems, THERMINIC 2012. p. 76-79 4 p. 6400619. (18th International Workshop on Thermal Investigation of ICs and Systems, THERMINIC 2012).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • 2011

    Thermal analysis of high power LEDs at working conditions

    Jang, S. H. & Shin, M. W., 2011, 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2011. 5992721. (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    1 Citation (Scopus)
  • Thermal analysis of the open type of laser diode

    Choi, J. H. & Shin, M. W., 2011, 17th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2011. p. 110-114 5 p. 6081045. (17th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2011).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    2 Citations (Scopus)
  • Thermal analysis of the type of metal design for light emitting diode

    Mun, S. H., Choi, J. H. & Shin, M. W., 2011, 17th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2011. p. 49-53 5 p. 6081014. (17th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2011).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    1 Citation (Scopus)
  • 2010

    Study on the thermal characteristics of GaN-based laser diodes

    Choi, J. H. & Shin, M. W., 2010, 10th International Conference on Numerical Simulation of Optoelectronic Devices, NUSOD 2010. p. 5-6 2 p. 5595693. (10th International Conference on Numerical Simulation of Optoelectronic Devices, NUSOD 2010).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    1 Citation (Scopus)
  • Thermal optimization of high power LED arrays with a fin cooling system

    Jang, S. H. & Shin, M. W., 2010, 10th International Conference on Numerical Simulation of Optoelectronic Devices, NUSOD 2010. p. 3-4 2 p. 5595696. (10th International Conference on Numerical Simulation of Optoelectronic Devices, NUSOD 2010).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    1 Citation (Scopus)
  • 2008

    Thermal analysis and modeling of led arrays for automotive headlamp

    Jang, S. H. & Shin, M. W., 2008, Proceedings of the ASME International Mechanical Engineering Congress and Exposition, IMECE 2007. p. 247-250 4 p. (ASME International Mechanical Engineering Congress and Exposition, Proceedings; vol. 5).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    1 Citation (Scopus)
  • Thermal and mechanical analysis of high power leds with ceramic packages

    Hu, J., Yang, L. & Shin, M. W., 2008, Proceedings of the ASME International Mechanical Engineering Congress and Exposition, IMECE 2007. p. 251-255 5 p. (ASME International Mechanical Engineering Congress and Exposition, Proceedings; vol. 5).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • 2007

    Characteristics of thermal performance in high power LED package with heat pipe

    Hwang, W. J., Yeo, H. J. & Shin, M. W., 2007, Advances in Nanomaterials and Processing - IUMRS - ICA - 2006 International Conference in Asia. PART 1 ed. Trans Tech Publications Ltd, p. 85-88 4 p. (Solid State Phenomena; vol. 124-126, no. PART 1).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    2 Citations (Scopus)
  • Investigation of thermal measurement variables in high power GaN-based LEDs

    Yang, L., Hu, J. & Shin, M. W., 2007, Advances in Nanomaterials and Processing - IUMRS - ICA - 2006 International Conference in Asia. PART 1 ed. Trans Tech Publications Ltd, p. 483-486 4 p. (Solid State Phenomena; vol. 124-126, no. PART 1).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    4 Citations (Scopus)
  • Thermal analysis and modeling of led arrays for automotive headlamp

    Jang, S. H. & Shin, M. W., 2007, Electronics and Photonics. American Society of Mechanical Engineers (ASME), p. 247-250 4 p. (ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE); vol. 5).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • Thermal and mechanical analysis of high power leds with ceramic packages

    Hu, J., Yang, L. & Shin, M. W., 2007, Electronics and Photonics. American Society of Mechanical Engineers (ASME), p. 251-255 5 p. (ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE); vol. 5).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    6 Citations (Scopus)
  • Thermal and mechanical analysis of high-power light-emitting diodes with ceramic packages

    Hu, J., Yang, L. & Shin, M. W., 2007, Collection of Papers Presented at The 13th International Workshop on THERMal INvestigation of Ics and Systems, THERMINIC 2007. p. 77-81 5 p. 4451751. (Collection of Papers Presented at The 13th International Workshop on THERMal INvestigation of ICs and Systems, THERMINIC).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    3 Citations (Scopus)
  • 2006

    Thermal analysis and design of high power LED packages and systems

    Kim, L. & Shin, M. W., 2006, Sixth International Conference on Solid State Lighting. 63370U. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 6337).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    13 Citations (Scopus)
  • Thermal analysis of multi-chip LED packages

    Kim, L., Choi, J., Jang, S. & Shin, M. W., 2006, Advanced LEDs for Solid State Lighting. 63550E. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 6355).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    4 Citations (Scopus)
  • Thermal design of high-power LED package and system

    Shin, M. W., 2006, Advanced LEDs for Solid State Lighting. 635509. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 6355).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    43 Citations (Scopus)
  • Thermal effects of moisture inducing delamination in light-emitting diode packages

    Jianzheng, H., Lianqiao, Y. & Moo, W. S., 2006, Advanced LEDs for Solid State Lighting. 635516. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 6355).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    2 Citations (Scopus)
  • Thermal effects of moisture inducing delamination in light-emitting diode packages

    Jianzheng, H., Lianqiao, Y. & Moo, W. S., 2006, Proceedings - IEEE 56th Electronic Components and Technology Conference. p. 1957-1962 6 p. 1645928. (Proceedings - Electronic Components and Technology Conference; vol. 2006).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    22 Citations (Scopus)
  • Thermal resistance analysis of high power LEDs with multi-chip package

    Kim, L., Hwang, W. J. & Shin, M. W., 2006, Proceedings - IEEE 56th Electronic Components and Technology Conference. p. 1076-1081 6 p. 1645787. (Proceedings - Electronic Components and Technology Conference; vol. 2006).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    19 Citations (Scopus)
  • Thermal resistance measurement of LEDs with multi-chip packages

    Kim, L. & Shin, M. W., 2006, Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium, SEMI-THERM 2006. p. 186-190 5 p. 1625226. (Annual IEEE Semiconductor Thermal Measurement and Management Symposium; vol. 2006).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    10 Citations (Scopus)
  • 2003

    Spin injection in an FeCo/Si/FeCo structure: A spin transistor

    Lee, H. J., Hwang, U. J., Cho, S. J., Kim, Y. M., Chang, J. Y., Park, Y. J., Han, S. H., Kim, Y. K., Shin, M. W. & Lee, W. Y., 2003, Intermag 2003 - Program of the 2003 IEEE International Magnetics Conference. Institute of Electrical and Electronics Engineers Inc., p. 9 1 p. 1230338. (Intermag 2003 - Program of the 2003 IEEE International Magnetics Conference).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • 2002

    Photoelectrochemical etching process of 6H-SiC wafers using HF-based solution and H2O2 solution as electrolytes

    Song, J. G. & Shin, M. W., 2002, Silicon Carbide and Related Materials 2001. Yoshida, S., Nishino, S., Harima, H. & Kimoto, T. (eds.). Trans Tech Publications Ltd, p. 957-960 4 p. (Materials Science Forum; vol. 389-393).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    1 Citation (Scopus)
  • Reactive ion etching process of 4H-SiC using the CHF3/O2 mixtures and a post-O2 plasma-etching process

    Kang, S. C. & Shin, M. W., 2002, Silicon Carbide and Related Materials 2001. Yoshida, S., Nishino, S., Harima, H. & Kimoto, T. (eds.). Trans Tech Publications Ltd, p. 949-952 4 p. (Materials Science Forum; vol. 389-393).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • Thermal analysis of GaN-Based HFET devices using the unit thermal profile approach

    Park, J., Lee, C. C., Kim, J. W., Lee, J. S., Lee, W. S., Shin, J. H. & Shin, M. W., 2002, Silicon Carbide and Related Materials 2001. Yoshida, S., Nishino, S., Harima, H. & Kimoto, T. (eds.). Trans Tech Publications Ltd, p. 1523-1526 4 p. (Materials Science Forum; vol. 389-393).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • 1995

    High-efficiency performance of microwave power 4H-SiC amplifiers

    Shin, M. W., Kordas, T. J. & Trew, R. J., 1995, IEEE International Symposium on Power Semiconductor Devices & ICs (ISPSD). p. 497-500 4 p. (IEEE International Symposium on Power Semiconductor Devices & ICs (ISPSD)).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    1 Citation (Scopus)
  • 1993

    High temperature operation of n-type 6H-SiC and p-type diamond MESFETs

    Shin, M. W., Bilbro, G. L. & Trew, R. J., 1993, Proceedings of the IEEE Cornell Conference on Advanced Concepts in High Speed Semiconductor Devices and Circuits. Anon (ed.). Publ by IEEE, p. 421-430 10 p. (Proceedings of the IEEE Cornell Conference on Advanced Concepts in High Speed Semiconductor Devices and Circuits).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    7 Citations (Scopus)
  • Model-based comparison of RF noise in oscillating diamond and SiC MESFETs

    Bilbro, G. L., Shin, M. W., Trew, R. J. & Riddle, A. N., 1993, Proceedings of the IEEE Cornell Conference on Advanced Concepts in High Speed Semiconductor Devices and Circuits. Anon (ed.). Publ by IEEE, p. 458-467 10 p. (Proceedings of the IEEE Cornell Conference on Advanced Concepts in High Speed Semiconductor Devices and Circuits).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution