• 7294 Citations
  • 27 h-Index
1991 …2020

Research output per year

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Research Output

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Conference contribution
2015

The influence of electrode on sensitivity of pH sensors fabricated on AlGaN/GaN Heterostructures

Lee, C. T., Jung, S. M. & Shin, M. W., 2015, NSTI: Biotech, Biomaterials and Biomedical - TechConnect Briefs 2015. Laudon, M. & Romanowicz, B. (eds.). Taylor and Francis Inc., p. 159-161 3 p. (NSTI: Advanced Materials - TechConnect Briefs 2015; vol. 3).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Thermal conductivity model for Polymer/Boron Nitride nanocomposite considering air void content

Park, S. Y., Kim, J. H. & Shin, M. W., 2015 Jan 1, NSTI: Advanced Materials - TechConnect Briefs 2015. Romanowicz, B. & Laudon, M. (eds.). Taylor and Francis Inc., p. 372-375 4 p. (NSTI: Advanced Materials - TechConnect Briefs 2015; vol. 1).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2012

Development and performance of LED metal package with an integrated reflector/heat slug structure

Kim, J. H., Choi, J. H., Mun, S. H. & Shin, M. W., 2012 Dec 1, 18th International Workshop on Thermal Investigation of ICs and Systems, THERMINIC 2012. p. 76-79 4 p. 6400619

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2011

Thermal analysis of high power LEDs at working conditions

Jang, S. H. & Shin, M. W., 2011 Sep 15, 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2011. 5992721. (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Thermal analysis of the open type of laser diode

Choi, J. H. & Shin, M. W., 2011 Dec 21, 17th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2011. p. 110-114 5 p. 6081045. (17th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2011).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Thermal analysis of the type of metal design for light emitting diode

Mun, S. H., Choi, J. H. & Shin, M. W., 2011 Dec 21, 17th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2011. p. 49-53 5 p. 6081014

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)
2010

Study on the thermal characteristics of GaN-based laser diodes

Choi, J. H. & Shin, M. W., 2010 Nov 24, 10th International Conference on Numerical Simulation of Optoelectronic Devices, NUSOD 2010. p. 5-6 2 p. 5595693. (10th International Conference on Numerical Simulation of Optoelectronic Devices, NUSOD 2010).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Thermal optimization of high power LED arrays with a fin cooling system

Jang, S. H. & Shin, M. W., 2010 Nov 24, 10th International Conference on Numerical Simulation of Optoelectronic Devices, NUSOD 2010. p. 3-4 2 p. 5595696

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)
2008

Thermal analysis and modeling of led arrays for automotive headlamp

Jang, S. H. & Shin, M. W., 2008 May 28, Proceedings of the ASME International Mechanical Engineering Congress and Exposition, IMECE 2007. Vol. 5. p. 247-250 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Thermal and mechanical analysis of high power leds with ceramic packages

Hu, J., Yang, L. & Shin, M. W., 2008 May 28, Proceedings of the ASME International Mechanical Engineering Congress and Exposition, IMECE 2007. Vol. 5. p. 251-255 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2007

Characteristics of thermal performance in high power LED package with heat pipe

Hwang, W. J., Yeo, H. J. & Shin, M. W., 2007, Advances in Nanomaterials and Processing - IUMRS - ICA - 2006 International Conference in Asia. PART 1 ed. Trans Tech Publications Ltd, p. 85-88 4 p. (Solid State Phenomena; vol. 124-126, no. PART 1).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Investigation of thermal measurement variables in high power GaN-based LEDs

Yang, L., Hu, J. & Shin, M. W., 2007, Advances in Nanomaterials and Processing - IUMRS - ICA - 2006 International Conference in Asia. PART 1 ed. Trans Tech Publications Ltd, p. 483-486 4 p. (Solid State Phenomena; vol. 124-126, no. PART 1).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Thermal analysis and modeling of led arrays for automotive headlamp

Jang, S. H. & Shin, M. W., 2007 Jan 1, Electronics and Photonics. American Society of Mechanical Engineers (ASME), p. 247-250 4 p. (ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE); vol. 5).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Thermal and mechanical analysis of high power leds with ceramic packages

Hu, J., Yang, L. & Shin, M. W., 2007 Jan 1, Electronics and Photonics. American Society of Mechanical Engineers (ASME), p. 251-255 5 p. (ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE); vol. 5).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Thermal and mechanical analysis of high-power light-emitting diodes with ceramic packages

Hu, J., Yang, L. & Shin, M. W., 2007 Dec 1, Collection of Papers Presented at The 13th International Workshop on THERMal INvestigation of Ics and Systems, THERMINIC 2007. p. 77-81 5 p. 4451751

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)
2006

Thermal analysis and design of high power LED packages and systems

Kim, L. & Shin, M. W., 2006 Nov 23, Sixth International Conference on Solid State Lighting. 63370U. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 6337).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

13 Citations (Scopus)

Thermal analysis of multi-chip LED packages

Kim, L., Choi, J., Jang, S. & Shin, M. W., 2006 Dec 27, Advanced LEDs for Solid State Lighting. Vol. 6355. 63550E

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Thermal design of high-power LED package and system

Shin, M. W., 2006 Dec 27, Advanced LEDs for Solid State Lighting. Vol. 6355. 635509

Research output: Chapter in Book/Report/Conference proceedingConference contribution

43 Citations (Scopus)

Thermal effects of moisture inducing delamination in light-emitting diode packages

Jianzheng, H., Lianqiao, Y. & Moo, W. S., 2006 Dec 27, Advanced LEDs for Solid State Lighting. Vol. 6355. 635516

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Thermal effects of moisture inducing delamination in light-emitting diode packages

Jianzheng, H., Lianqiao, Y. & Moo, W. S., 2006 Dec 22, Proceedings - IEEE 56th Electronic Components and Technology Conference. Vol. 2006. p. 1957-1962 6 p. 1645928

Research output: Chapter in Book/Report/Conference proceedingConference contribution

21 Citations (Scopus)

Thermal resistance analysis of high power LEDs with multi-chip package

Kim, L., Hwang, W. J. & Shin, M. W., 2006 Dec 22, Proceedings - IEEE 56th Electronic Components and Technology Conference. Vol. 2006. p. 1076-1081 6 p. 1645787

Research output: Chapter in Book/Report/Conference proceedingConference contribution

19 Citations (Scopus)

Thermal resistance measurement of LEDs with multi-chip packages

Kim, L. & Shin, M. W., 2006 Oct 24, Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium, SEMI-THERM 2006. Vol. 2006. p. 186-190 5 p. 1625226

Research output: Chapter in Book/Report/Conference proceedingConference contribution

10 Citations (Scopus)
2003

Spin injection in an FeCo/Si/FeCo structure: A spin transistor

Lee, H. J., Hwang, U. J., Cho, S. J., Kim, Y. M., Chang, J. Y., Park, Y. J., Han, S. H., Kim, Y. K., Shin, M. W. & Lee, W. Y., 2003 Jan 1, Intermag 2003 - Program of the 2003 IEEE International Magnetics Conference. Institute of Electrical and Electronics Engineers Inc., 1230338. (Intermag 2003 - Program of the 2003 IEEE International Magnetics Conference).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2002

Photoelectrochemical etching process of 6H-SiC wafers using HF-based solution and H2O2 solution as electrolytes

Song, J. G. & Shin, M. W., 2002 Jan 1, Silicon Carbide and Related Materials 2001. Harima, H., Kimoto, T., Nishino, S. & Yoshida, S. (eds.). Trans Tech Publications Ltd, p. 957-960 4 p. (Materials Science Forum; vol. 389-393).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Reactive ion etching process of 4H-SiC using the CHF3/O2 mixtures and a post-O2 plasma-etching process

Kang, S. C. & Shin, M. W., 2002, Silicon Carbide and Related Materials 2001. Yoshida, S., Nishino, S., Harima, H. & Kimoto, T. (eds.). Trans Tech Publications Ltd, p. 949-952 4 p. (Materials Science Forum; vol. 389-393).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Thermal analysis of GaN-Based HFET devices using the unit thermal profile approach

Park, J., Lee, C. C., Kim, J. W., Lee, J. S., Lee, W. S., Shin, J. H. & Shin, M. W., 2002 Jan 1, Silicon Carbide and Related Materials 2001. Harima, H., Kimoto, T., Nishino, S. & Yoshida, S. (eds.). Trans Tech Publications Ltd, p. 1523-1526 4 p. (Materials Science Forum; vol. 389-393).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1995

High-efficiency performance of microwave power 4H-SiC amplifiers

Shin, M. W., Kordas, T. J. & Trew, R. J., 1995 Jan 1, IEEE International Symposium on Power Semiconductor Devices & ICs (ISPSD). p. 497-500 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)
1993

High temperature operation of n-type 6H-SiC and p-type diamond MESFETs

Shin, M. W., Bilbro, G. L. & Trew, R. J., 1993 Dec 1, Proceedings of the IEEE Cornell Conference on Advanced Concepts in High Speed Semiconductor Devices and Circuits. Anon (ed.). Publ by IEEE, p. 421-430 10 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)

Model-based comparison of RF noise in oscillating diamond and SiC MESFETs

Bilbro, G. L., Shin, M. W., Trew, R. J. & Riddle, A. N., 1993 Dec 1, Proceedings of the IEEE Cornell Conference on Advanced Concepts in High Speed Semiconductor Devices and Circuits. Anon (ed.). Publ by IEEE, p. 458-467 10 p. (Proceedings of the IEEE Cornell Conference on Advanced Concepts in High Speed Semiconductor Devices and Circuits).

Research output: Chapter in Book/Report/Conference proceedingConference contribution