Research output per year
Research output per year
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Dive into the research topics where Sanghoon Lee is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
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Research output
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A Simple Method on Generating Synthetic Data for Training Real-time Object Detection Networks
Huh, J., Lee, K., Lee, I. & Lee, S., 2019 Mar 4, 2018 Asia-Pacific Signal and Information Processing Association Annual Summit and Conference, APSIPA ASC 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 1518-1522 5 p. 8659778. (2018 Asia-Pacific Signal and Information Processing Association Annual Summit and Conference, APSIPA ASC 2018 - Proceedings).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
1 Citation (Scopus) -
Deep CNN-Based Blind Image Quality Predictor
Kim, J., Nguyen, A. D. & Lee, S., 2019 Jan, In: IEEE Transactions on Neural Networks and Learning Systems. 30, 1, p. 11-24 14 p., 8383698.Research output: Contribution to journal › Article › peer-review
65 Citations (Scopus) -
Deep Visual Saliency on Stereoscopic Images
Nguyen, A. D., Kim, J., Oh, H., Kim, H., Lin, W. & Lee, S., 2019 Apr, In: IEEE Transactions on Image Processing. 28, 4, p. 1939-1953 15 p., 8520871.Research output: Contribution to journal › Article › peer-review
13 Citations (Scopus) -
Error detection algorithm for Lempel-Ziv-77 compressed data
Kwon, B. & Lee, S., 2019 Apr, In: Journal of Communications and Networks. 21, 2, p. 100-112 13 p., 8718090.Research output: Contribution to journal › Article › peer-review
5 Citations (Scopus) -
Identification and Restoration of LZ77 Compressed Data Using a Machine Learning Approach
Kwon, B., Gong, M., Huh, J. & Lee, S., 2019 Mar 4, 2018 Asia-Pacific Signal and Information Processing Association Annual Summit and Conference, APSIPA ASC 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 1787-1790 4 p. 8659755. (2018 Asia-Pacific Signal and Information Processing Association Annual Summit and Conference, APSIPA ASC 2018 - Proceedings).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
5 Citations (Scopus)
Press / Media
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Samsung Electronics Submits Patent Application for Integrated Circuit Device and Method of Manufacturing the Same
21/4/29
1 item of Media coverage
Press/Media: Press / Media
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Samsung Electronics Submits United States Patent Application for Bonding Head, Die Bonding Apparatus Including the Same and Method of Manufacturing Semiconductor Package Using the Same
21/4/1
1 item of Media coverage
Press/Media: Press / Media
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US Patent Issued to SAMSUNG ELECTRONICS on March 16 for "Three dimensional semiconductor memory with residual memory layer" (South Korean Inventors)
21/3/17
1 item of Media coverage
Press/Media: Press / Media
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US Patent Issued to SAMSUNG ELECTRONICS on Jan. 26 for "Three-dimensional semiconductor memory devices and methods of fabricating the same" (South Korean Inventors)
21/1/27
1 item of Media coverage
Press/Media: Press / Media
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Samsung Electronics Applies for Patent on Electronic Device Including Interposer
21/1/14
1 item of Media coverage
Press/Media: Press / Media