3-D construction of monolithic passive components for RF and microwave ICs using thick-metal surface micromachining technology

Jun Boo Yoon, Byeong Il Kim, Yun Seok Choi, Euisik Yoon

Research output: Contribution to journalArticle

80 Citations (Scopus)


As a viable technological option to address today's strong demands for high-performance monolithic low-cost passive components in RF and microwave integrated circuits (ICs), a new CMOS-compatible versatile thick-metal surface micromachining technology has been developed. This technology enables to build arbitrary three-dimensional (3-D) metal microstructures on standard silicon substrate as post-IC processes at low temperature below 120°C. Using this technology, various highly suspended 3-D microstructures have been successfully demonstrated for RF and microwave IC applications. We have demonstrated spiral inductors suspended 100 μm over the substrate, coplanar waveguides suspended 50 μm over the substrate, and complicated microcoaxial lines, which have 50-μm-suspended center signal lines surrounded by inclined ground shields of 100 μm in height. The microwave performance of the microcoaxial transmission line fabricated on a glass substrate has been evaluated to achieve very low attenuation of 0.03 dB/mm at 10 GHz with an effective dielectric constant of 1.6. The process variation/manufacturability, mechanical stability, and package issues also have been discussed in detail.

Original languageEnglish
Pages (from-to)279-288
Number of pages10
JournalIEEE Transactions on Microwave Theory and Techniques
Issue number1 II
Publication statusPublished - 2003 Jan 1


All Science Journal Classification (ASJC) codes

  • Radiation
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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