3-D construction of monolithic passive components for RF and microwave ICs using thick-metal surface micromachining technology

Jun Boo Yoon, Byeong Il Kim, Yun Seok Choi, Euisik Yoon

Research output: Contribution to journalArticlepeer-review

82 Citations (Scopus)

Fingerprint

Dive into the research topics of '3-D construction of monolithic passive components for RF and microwave ICs using thick-metal surface micromachining technology'. Together they form a unique fingerprint.

Engineering

Physics

Computer Science

Material Science