3-D lithography and metal surface micromachining for RF and microwave MEMS

Jun Bo Yoon, Byeong Il Kim, Yun Seok Choi, Euisik Yoon

Research output: Contribution to conferencePaper

26 Citations (Scopus)

Abstract

A new metal surface micromachining technology utilizing 3-D lithography, electroplating, and mechanical polishing has been developed to fabricate arbitrary 3-D metal microstructures as post-IC processes at low temperature below 120°C. Using this technology, various highly-suspended 3-D microstructures have been successfully demonstrated for RF and microwave MEMS applications. We have fabricated spiral inductors suspended 100μm over the substrate, coplanar waveguides suspended 50μm over the substrate, and complicated micro-coaxial lines which have 50μm-suspended center signal lines surrounded by ground shields of 100μm in height.

Original languageEnglish
Pages673-676
Number of pages4
Publication statusPublished - 2002 Jan 1
Event15th IEEE International Conference on Micro Electro Mechanical Systems MEMS 2002 - Las Vegas, NV, United States
Duration: 2002 Jan 202002 Jan 24

Conference

Conference15th IEEE International Conference on Micro Electro Mechanical Systems MEMS 2002
CountryUnited States
CityLas Vegas, NV
Period02/1/2002/1/24

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All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering
  • Mechanical Engineering
  • Electrical and Electronic Engineering

Cite this

Yoon, J. B., Kim, B. I., Choi, Y. S., & Yoon, E. (2002). 3-D lithography and metal surface micromachining for RF and microwave MEMS. 673-676. Paper presented at 15th IEEE International Conference on Micro Electro Mechanical Systems MEMS 2002, Las Vegas, NV, United States.