3D face reconstruction from one side-view face images

Jaeik Jo, Yu Jin Jung, Jaihie Kim

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

This paper presents a 3D face reconstruction method from one side-view face images. In order to reconstruct 3D face, Structure from Motion (SfM) method, which has widely used to reconstruct 3D face, and bilateral symmetry of human face are used. In the experiments, the reconstructed 3D facial shape is quantitatively compared with the 3D facial shape obtained from a 3D scanner, and the results show that the proposed method is very useful to reconstruct an accurate 3D face when only one side-view face images are available.

Original languageEnglish
Title of host publication13th International Conference on Electronics, Information, and Communication, ICEIC 2014 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781479939428
DOIs
Publication statusPublished - 2014 Jan 1
Event13th International Conference on Electronics, Information, and Communication, ICEIC 2014 - Kota Kinabalu, Malaysia
Duration: 2014 Jan 152014 Jan 18

Other

Other13th International Conference on Electronics, Information, and Communication, ICEIC 2014
CountryMalaysia
CityKota Kinabalu
Period14/1/1514/1/18

Fingerprint

Experiments

All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Cite this

Jo, J., Jung, Y. J., & Kim, J. (2014). 3D face reconstruction from one side-view face images. In 13th International Conference on Electronics, Information, and Communication, ICEIC 2014 - Proceedings [6914359] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ELINFOCOM.2014.6914359
Jo, Jaeik ; Jung, Yu Jin ; Kim, Jaihie. / 3D face reconstruction from one side-view face images. 13th International Conference on Electronics, Information, and Communication, ICEIC 2014 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2014.
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Jo, J, Jung, YJ & Kim, J 2014, 3D face reconstruction from one side-view face images. in 13th International Conference on Electronics, Information, and Communication, ICEIC 2014 - Proceedings., 6914359, Institute of Electrical and Electronics Engineers Inc., 13th International Conference on Electronics, Information, and Communication, ICEIC 2014, Kota Kinabalu, Malaysia, 14/1/15. https://doi.org/10.1109/ELINFOCOM.2014.6914359

3D face reconstruction from one side-view face images. / Jo, Jaeik; Jung, Yu Jin; Kim, Jaihie.

13th International Conference on Electronics, Information, and Communication, ICEIC 2014 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2014. 6914359.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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N2 - This paper presents a 3D face reconstruction method from one side-view face images. In order to reconstruct 3D face, Structure from Motion (SfM) method, which has widely used to reconstruct 3D face, and bilateral symmetry of human face are used. In the experiments, the reconstructed 3D facial shape is quantitatively compared with the 3D facial shape obtained from a 3D scanner, and the results show that the proposed method is very useful to reconstruct an accurate 3D face when only one side-view face images are available.

AB - This paper presents a 3D face reconstruction method from one side-view face images. In order to reconstruct 3D face, Structure from Motion (SfM) method, which has widely used to reconstruct 3D face, and bilateral symmetry of human face are used. In the experiments, the reconstructed 3D facial shape is quantitatively compared with the 3D facial shape obtained from a 3D scanner, and the results show that the proposed method is very useful to reconstruct an accurate 3D face when only one side-view face images are available.

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Jo J, Jung YJ, Kim J. 3D face reconstruction from one side-view face images. In 13th International Conference on Electronics, Information, and Communication, ICEIC 2014 - Proceedings. Institute of Electrical and Electronics Engineers Inc. 2014. 6914359 https://doi.org/10.1109/ELINFOCOM.2014.6914359