3D Heterogeneous Device Arrays for Multiplexed Sensing Platforms Using Transfer of Perovskites

Jiuk Jang, Young Geun Park, Eunkyung Cha, Sangyoon Ji, Hyunbin Hwang, Gon Guk Kim, Jungho Jin, Jang Ung Park

Research output: Contribution to journalArticlepeer-review

10 Citations (Scopus)


Despite recent substantial advances in perovskite materials, their 3D integration capability for next-generation electronic devices is limited owing to their inherent vulnerability to heat and moisture with degradation of their remarkable optoelectronic properties during fabrication processing. Herein, a facile method to transfer the patterns of perovskites to planar or nonplanar surfaces using a removable polymer is reported. After fabricating perovskite devices on this removable polymer film, the conformal attachment of this film on target surfaces can place the entire devices on various substrates by removing this sacrificial film. This transfer method enables the formation of a perovskite image sensor array on a soft contact lens, and in vivo tests using rabbits demonstrate its wearability. Furthermore, 3D heterogeneous integration of a perovskite photodetector array with an active-matrix array of pressure-sensitive silicon transistors using this transfer method demonstrates the formation of a multiplexed sensing platform detecting distributions of light and tactile pressure simultaneously.

Original languageEnglish
Article number2101093
JournalAdvanced Materials
Issue number30
Publication statusPublished - 2021 Jul 28

Bibliographical note

Funding Information:
J.J. and Y.‐G.P. contributed equally to this work. This work was supported by the Ministry of Science and ICT (MSIT) and the Ministry of Trade, Industry and Energy (MOTIE) of Korea through the National Research Foundation (2019R1A2B5B03069358 and 2016R1A5A1009926), the Korea Initiative for fostering University of Research and Innovation (KIURI) Program (2020M3H1A1077207), the Bio & Medical Technology Development Program (2018M3A9F1021649), the Nano Material Technology Development Program (2016M3A7B4910635), and the Technology Innovation Program (20010366 and 20013621, Center for Super Critical Material Industrial Technology). The authors also thank financial support by the Institute for Basic Science (IBS‐R026‐D1) and the Research Program (2019‐22‐0228) funded by Yonsei University.

Publisher Copyright:
© 2021 Wiley-VCH GmbH

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering


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