Abstract
With the development of memory manufacturing technology, the density of memory die has been increased and more data can be stored in a small area than before. However, due to the complexity of the manufacturing process, faults in memory have increased. And it leads to poor yield and quality of memory. To improve yield and quality of the memory, the importance of memory test and repair is growing to maintain memory productivity. This paper presents solutions for test and repair in pre-bond. In the pre-bond, proposed method makes a new 3D stacked memory by using unrepairable memory dice which cannot be repaired with existing spare memories. Discard the bank with the largest number of faults in the unrepairable memory die and repair the remaining banks. The memory dice and a spare layer which made of the known good die or unrepairable memory die are stacked to create a 3D memory. A bank of the spare layer is mapped to discarded bank of unrepairable memory die to operate as one normal working memory die. The proposed method can lead to high yields of 3D stacked memory.
| Original language | English |
|---|---|
| Title of host publication | Proceedings of TENCON 2018 - 2018 IEEE Region 10 Conference |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 1362-1366 |
| Number of pages | 5 |
| ISBN (Electronic) | 9781538654576 |
| DOIs | |
| Publication status | Published - 2019 Feb 22 |
| Event | 2018 IEEE Region 10 Conference, TENCON 2018 - Jeju, Korea, Republic of Duration: 2018 Oct 28 → 2018 Oct 31 |
Publication series
| Name | IEEE Region 10 Annual International Conference, Proceedings/TENCON |
|---|---|
| Volume | 2018-October |
| ISSN (Print) | 2159-3442 |
| ISSN (Electronic) | 2159-3450 |
Conference
| Conference | 2018 IEEE Region 10 Conference, TENCON 2018 |
|---|---|
| Country | Korea, Republic of |
| City | Jeju |
| Period | 18/10/28 → 18/10/31 |
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All Science Journal Classification (ASJC) codes
- Computer Science Applications
- Electrical and Electronic Engineering
Cite this
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3D Memory Formed of Unrepairable Memory Dice and Spare Layer. / Han, Donghyun; Lee, Hayoug; Lee, Seungtaek; Moon, Minho; Kang, Sungho.
Proceedings of TENCON 2018 - 2018 IEEE Region 10 Conference. Institute of Electrical and Electronics Engineers Inc., 2019. p. 1362-1366 8650278 (IEEE Region 10 Annual International Conference, Proceedings/TENCON; Vol. 2018-October).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
TY - GEN
T1 - 3D Memory Formed of Unrepairable Memory Dice and Spare Layer
AU - Han, Donghyun
AU - Lee, Hayoug
AU - Lee, Seungtaek
AU - Moon, Minho
AU - Kang, Sungho
PY - 2019/2/22
Y1 - 2019/2/22
N2 - With the development of memory manufacturing technology, the density of memory die has been increased and more data can be stored in a small area than before. However, due to the complexity of the manufacturing process, faults in memory have increased. And it leads to poor yield and quality of memory. To improve yield and quality of the memory, the importance of memory test and repair is growing to maintain memory productivity. This paper presents solutions for test and repair in pre-bond. In the pre-bond, proposed method makes a new 3D stacked memory by using unrepairable memory dice which cannot be repaired with existing spare memories. Discard the bank with the largest number of faults in the unrepairable memory die and repair the remaining banks. The memory dice and a spare layer which made of the known good die or unrepairable memory die are stacked to create a 3D memory. A bank of the spare layer is mapped to discarded bank of unrepairable memory die to operate as one normal working memory die. The proposed method can lead to high yields of 3D stacked memory.
AB - With the development of memory manufacturing technology, the density of memory die has been increased and more data can be stored in a small area than before. However, due to the complexity of the manufacturing process, faults in memory have increased. And it leads to poor yield and quality of memory. To improve yield and quality of the memory, the importance of memory test and repair is growing to maintain memory productivity. This paper presents solutions for test and repair in pre-bond. In the pre-bond, proposed method makes a new 3D stacked memory by using unrepairable memory dice which cannot be repaired with existing spare memories. Discard the bank with the largest number of faults in the unrepairable memory die and repair the remaining banks. The memory dice and a spare layer which made of the known good die or unrepairable memory die are stacked to create a 3D memory. A bank of the spare layer is mapped to discarded bank of unrepairable memory die to operate as one normal working memory die. The proposed method can lead to high yields of 3D stacked memory.
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UR - http://www.scopus.com/inward/citedby.url?scp=85063205440&partnerID=8YFLogxK
U2 - 10.1109/TENCON.2018.8650278
DO - 10.1109/TENCON.2018.8650278
M3 - Conference contribution
T3 - IEEE Region 10 Annual International Conference, Proceedings/TENCON
SP - 1362
EP - 1366
BT - Proceedings of TENCON 2018 - 2018 IEEE Region 10 Conference
PB - Institute of Electrical and Electronics Engineers Inc.
ER -