3D network-on-chip with wireless links through inductive coupling

Jinho Lee, Mingyang Zhu, Kiyoung Choi, Jung Ho Ahn, Rohit Sharma

Research output: Chapter in Book/Report/Conference proceedingConference contribution

10 Citations (Scopus)

Abstract

Utilizing network-on-chips for manycore SoCs has already been studied widely, as traditional bus-based architectures are unlikely to endure so many inter-core communications. Since device scaling has come to a limit, the technology trend now is stacking dies three-dimensionally to obtain more silicon area and shorter wire length. The most challenging part for making a 3D chip is inter-layer communication method. Currently, TSV is the most popular and promising technique to provide the best performance. However, it suffers from many problems due to inter-layer wiring. As a substitute, inductive coupling can be used as a reliable and non-expensive technology. In this work, we use inductive coupling for the inter-layer communication to build a 3D NoC. We also propose a token bus protocol for an efficient implementation of multi-layer communications. Experimental results show that the proposed architecture achieves maximum throughput of 4.7 flits/cycle under uniform random traffic.

Original languageEnglish
Title of host publication2011 International SoC Design Conference, ISOCC 2011
PublisherIEEE Computer Society
Pages353-356
Number of pages4
ISBN (Print)9781457707100
DOIs
Publication statusPublished - 2011
Event8th International SoC Design Conference 2011, ISOCC 2011 - Jeju, Korea, Republic of
Duration: 2011 Nov 172011 Nov 18

Publication series

Name2011 International SoC Design Conference, ISOCC 2011

Other

Other8th International SoC Design Conference 2011, ISOCC 2011
CountryKorea, Republic of
CityJeju
Period11/11/1711/11/18

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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  • Cite this

    Lee, J., Zhu, M., Choi, K., Ahn, J. H., & Sharma, R. (2011). 3D network-on-chip with wireless links through inductive coupling. In 2011 International SoC Design Conference, ISOCC 2011 (pp. 353-356). (2011 International SoC Design Conference, ISOCC 2011). IEEE Computer Society. https://doi.org/10.1109/isocc.2011.6138783