A 0.53pJK2 7000μm2 resistor-based temperature sensor with an inaccuracy of ±0.35°C (3σ) in 65nm CMOS

Woojun Choi, Yong Tae Lee, Seonhong Kim, Sanghoon Lee, Jieun Jang, Junhyun Chun, Kofi A.A. Makinwa, Youngcheol Chae

Research output: Chapter in Book/Report/Conference proceedingConference contribution

12 Citations (Scopus)


In microprocessors and DRAMs, on-chip temperature sensors are essential components, ensuring reliability by monitoring thermal gradients and hot spots. Such sensors must be as small as possible, since multiple sensors are required for dense thermal monitoring. However, conventional BJT-based temperature sensors are not compatible with the sub-1V supply of advanced processes. Subthreshold MOSFETs can operate from lower supplies, but at high temperatures their performance is limited by leakage [1,2]. Thermal diffusivity (TD) sensors achieve sub-1V operation and small area with moderate accuracy, but require milliwatts of power [3]. Recently, resistor-based sensors based on RC WienBridge (WB) filters have realized high resolution and energy efficiency [4,5]. Fundamentally, they are robust to process and supply-voltage scaling. However, their readout circuitry has been based on continuous-time (CT) ΔΣ ADCs or frequency-locked loops (FLLs), which require precision analog circuits and occupy considerable area (>0.7mm2).

Original languageEnglish
Title of host publication2018 IEEE International Solid-State Circuits Conference, ISSCC 2018
PublisherInstitute of Electrical and Electronics Engineers Inc.
Number of pages3
ISBN (Electronic)9781509049394
Publication statusPublished - 2018 Mar 8
Event65th IEEE International Solid-State Circuits Conference, ISSCC 2018 - San Francisco, United States
Duration: 2018 Feb 112018 Feb 15

Publication series

NameDigest of Technical Papers - IEEE International Solid-State Circuits Conference
ISSN (Print)0193-6530


Other65th IEEE International Solid-State Circuits Conference, ISSCC 2018
Country/TerritoryUnited States
CitySan Francisco

Bibliographical note

Funding Information:
This paper was the result of a research project supported by SK Hynix Inc. and it was also supported by NRF (National Research Foundation of Korea) Grant funded by the Korean Government (NRF-2016-Global Ph.D. Fellowship Program).

Publisher Copyright:
© 2018 IEEE.

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering


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