Abstract
The post-silicon validation has been an important step as the complexity of system on chip (SoC) increases. Conventional trace buffer based debug methods offer consecutive observability and real time debug, but the size constraint of the trace buffer still is a challenge. The proposed method uses 2-D compaction for expanding the depth of observation window in a trace buffer. Moreover, the macro block, which is used with 2-D compaction, offers tolerance to various error patterns as a virtual window. The errors identified by the 2-D compaction using the macro block are selectively captured by using the new tag map. The experimental results show that the proposed method enables the reduction of error misidentification.
Original language | English |
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Title of host publication | ISOCC 2015 - International SoC Design Conference |
Subtitle of host publication | SoC for Internet of Everything (IoE) |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
Pages | 41-42 |
Number of pages | 2 |
ISBN (Electronic) | 9781467393089 |
DOIs | |
Publication status | Published - 2016 Feb 8 |
Event | 12th International SoC Design Conference, ISOCC 2015 - Gyeongju, Korea, Republic of Duration: 2015 Nov 2 → 2015 Nov 5 |
Publication series
Name | ISOCC 2015 - International SoC Design Conference: SoC for Internet of Everything (IoE) |
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Other
Other | 12th International SoC Design Conference, ISOCC 2015 |
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Country/Territory | Korea, Republic of |
City | Gyeongju |
Period | 15/11/2 → 15/11/5 |
Bibliographical note
Publisher Copyright:© 2015 IEEE.
All Science Journal Classification (ASJC) codes
- Hardware and Architecture
- Electrical and Electronic Engineering
- Electronic, Optical and Magnetic Materials