A 3.4μW CMOS image sensor with embedded feature-extraction algorithm for motion-triggered object-of-interest imaging

Jaehyuk Choi, Seokjun Park, Jihyun Cho, Euisik Yoon

Research output: Chapter in Book/Report/Conference proceedingConference contribution

21 Citations (Scopus)

Abstract

Distributed sensor nodes typically operate under the constraint of limited energy source, and power consumption is an important factor to extend the lifetime of sensor systems. Several low-power imagers have been reported for application to wireless sensor networks [1,2]. However, the biggest power consumption comes from wireless signal transmission due to the large bandwidth of image signals [3]. One way to reduce the bandwidth is to generate signals only when an event happens, by monitoring temporal changes [3-5]. However, this event-based imaging has extraneous redundancy because the sensor may also respond to environmental conditions, such as change of illumination or background movement in addition to actual target objects.

Original languageEnglish
Title of host publication2013 IEEE International Solid-State Circuits Conference, ISSCC 2013 - Digest of Technical Papers
Pages478-479
Number of pages2
DOIs
Publication statusPublished - 2013 Apr 29
Event2013 60th IEEE International Solid-State Circuits Conference, ISSCC 2013 - San Francisco, CA, United States
Duration: 2013 Feb 172013 Feb 21

Publication series

NameDigest of Technical Papers - IEEE International Solid-State Circuits Conference
Volume56
ISSN (Print)0193-6530

Other

Other2013 60th IEEE International Solid-State Circuits Conference, ISSCC 2013
CountryUnited States
CitySan Francisco, CA
Period13/2/1713/2/21

Fingerprint

Image sensors
Feature extraction
Electric power utilization
Bandwidth
Imaging techniques
Sensors
Sensor nodes
Redundancy
Wireless sensor networks
Lighting
Monitoring

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Cite this

Choi, J., Park, S., Cho, J., & Yoon, E. (2013). A 3.4μW CMOS image sensor with embedded feature-extraction algorithm for motion-triggered object-of-interest imaging. In 2013 IEEE International Solid-State Circuits Conference, ISSCC 2013 - Digest of Technical Papers (pp. 478-479). [6487822] (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; Vol. 56). https://doi.org/10.1109/ISSCC.2013.6487822
Choi, Jaehyuk ; Park, Seokjun ; Cho, Jihyun ; Yoon, Euisik. / A 3.4μW CMOS image sensor with embedded feature-extraction algorithm for motion-triggered object-of-interest imaging. 2013 IEEE International Solid-State Circuits Conference, ISSCC 2013 - Digest of Technical Papers. 2013. pp. 478-479 (Digest of Technical Papers - IEEE International Solid-State Circuits Conference).
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Choi, J, Park, S, Cho, J & Yoon, E 2013, A 3.4μW CMOS image sensor with embedded feature-extraction algorithm for motion-triggered object-of-interest imaging. in 2013 IEEE International Solid-State Circuits Conference, ISSCC 2013 - Digest of Technical Papers., 6487822, Digest of Technical Papers - IEEE International Solid-State Circuits Conference, vol. 56, pp. 478-479, 2013 60th IEEE International Solid-State Circuits Conference, ISSCC 2013, San Francisco, CA, United States, 13/2/17. https://doi.org/10.1109/ISSCC.2013.6487822

A 3.4μW CMOS image sensor with embedded feature-extraction algorithm for motion-triggered object-of-interest imaging. / Choi, Jaehyuk; Park, Seokjun; Cho, Jihyun; Yoon, Euisik.

2013 IEEE International Solid-State Circuits Conference, ISSCC 2013 - Digest of Technical Papers. 2013. p. 478-479 6487822 (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; Vol. 56).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Choi J, Park S, Cho J, Yoon E. A 3.4μW CMOS image sensor with embedded feature-extraction algorithm for motion-triggered object-of-interest imaging. In 2013 IEEE International Solid-State Circuits Conference, ISSCC 2013 - Digest of Technical Papers. 2013. p. 478-479. 6487822. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference). https://doi.org/10.1109/ISSCC.2013.6487822