A 5.9μm-pixel 2D/3D image sensor with background suppression over 100klx

Jihyun Cho; Jaehyuk Choi; Seong Jin Kim; Jungsoon Shin; Seokjun Park; James D.K. Kim; Euisik Yoon

A 5.9μm-pixel 2D/3D image sensor with background suppression over 100klx

Jihyun Cho, Jaehyuk Choi, Seong Jin Kim, Jungsoon Shin, Seokjun Park, James D.K. Kim, Euisik Yoon

Yonsei Advanced Science Institute

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

8 Citations (Scopus)

Abstract

A 2D/3D image sensor with reconfigurable pixel array and column-level background suppression scheme is presented for high resolution outdoor imaging. The proposed pixel array employs pixel binning and superresolution techniques for adaptable resolution. The sensor achieved a 5.9μm pixel and was able to capture full resolution outdoor depth images under daylight over 100klx.

Original language	English
Title of host publication	2013 Symposium on VLSI Circuits, VLSIC 2013 - Digest of Technical Papers
Pages	C6-C7
Publication status	Published - 2013
Event	2013 Symposium on VLSI Circuits, VLSIC 2013 - Kyoto, Japan Duration: 2013 Jun 12 → 2013 Jun 14

Publication series

Name	IEEE Symposium on VLSI Circuits, Digest of Technical Papers

Conference

Conference	2013 Symposium on VLSI Circuits, VLSIC 2013
Country	Japan
City	Kyoto
Period	13/6/12 → 13/6/14

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Access to Document

Fingerprint Dive into the research topics of 'A 5.9μm-pixel 2D/3D image sensor with background suppression over 100klx'. Together they form a unique fingerprint.

Cite this

@inproceedings{b2506a99f21b451ba6e3a1c4769fb1ad,

title = "A 5.9μm-pixel 2D/3D image sensor with background suppression over 100klx",

abstract = "A 2D/3D image sensor with reconfigurable pixel array and column-level background suppression scheme is presented for high resolution outdoor imaging. The proposed pixel array employs pixel binning and superresolution techniques for adaptable resolution. The sensor achieved a 5.9μm pixel and was able to capture full resolution outdoor depth images under daylight over 100klx.",

author = "Jihyun Cho and Jaehyuk Choi and Kim, {Seong Jin} and Jungsoon Shin and Seokjun Park and Kim, {James D.K.} and Euisik Yoon",

year = "2013",

language = "English",

isbn = "9784863483484",

series = "IEEE Symposium on VLSI Circuits, Digest of Technical Papers",

pages = "C6--C7",

booktitle = "2013 Symposium on VLSI Circuits, VLSIC 2013 - Digest of Technical Papers",

}

Cho, J, Choi, J, Kim, SJ, Shin, J, Park, S, Kim, JDK & Yoon, E 2013, A 5.9μm-pixel 2D/3D image sensor with background suppression over 100klx. in 2013 Symposium on VLSI Circuits, VLSIC 2013 - Digest of Technical Papers., 6578705, IEEE Symposium on VLSI Circuits, Digest of Technical Papers, pp. C6-C7, 2013 Symposium on VLSI Circuits, VLSIC 2013, Kyoto, Japan, 13/6/12.

A 5.9μm-pixel 2D/3D image sensor with background suppression over 100klx. / Cho, Jihyun; Choi, Jaehyuk; Kim, Seong Jin; Shin, Jungsoon; Park, Seokjun; Kim, James D.K.; Yoon, Euisik.

2013 Symposium on VLSI Circuits, VLSIC 2013 - Digest of Technical Papers. 2013. p. C6-C7 6578705 (IEEE Symposium on VLSI Circuits, Digest of Technical Papers).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - A 5.9μm-pixel 2D/3D image sensor with background suppression over 100klx

AU - Cho, Jihyun

AU - Choi, Jaehyuk

AU - Kim, Seong Jin

AU - Shin, Jungsoon

AU - Park, Seokjun

AU - Kim, James D.K.

AU - Yoon, Euisik

PY - 2013

Y1 - 2013

N2 - A 2D/3D image sensor with reconfigurable pixel array and column-level background suppression scheme is presented for high resolution outdoor imaging. The proposed pixel array employs pixel binning and superresolution techniques for adaptable resolution. The sensor achieved a 5.9μm pixel and was able to capture full resolution outdoor depth images under daylight over 100klx.

AB - A 2D/3D image sensor with reconfigurable pixel array and column-level background suppression scheme is presented for high resolution outdoor imaging. The proposed pixel array employs pixel binning and superresolution techniques for adaptable resolution. The sensor achieved a 5.9μm pixel and was able to capture full resolution outdoor depth images under daylight over 100klx.

UR - http://www.scopus.com/inward/record.url?scp=84883759954&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84883759954&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:84883759954

SN - 9784863483484

T3 - IEEE Symposium on VLSI Circuits, Digest of Technical Papers

SP - C6-C7

BT - 2013 Symposium on VLSI Circuits, VLSIC 2013 - Digest of Technical Papers

T2 - 2013 Symposium on VLSI Circuits, VLSIC 2013

Y2 - 12 June 2013 through 14 June 2013

ER -