A 5.9μm-pixel 2D/3D image sensor with background suppression over 100klx

Jihyun Cho, Jaehyuk Choi, Seong Jin Kim, Jungsoon Shin, Seokjun Park, James D.K. Kim, Euisik Yoon

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Citations (Scopus)

Abstract

A 2D/3D image sensor with reconfigurable pixel array and column-level background suppression scheme is presented for high resolution outdoor imaging. The proposed pixel array employs pixel binning and superresolution techniques for adaptable resolution. The sensor achieved a 5.9μm pixel and was able to capture full resolution outdoor depth images under daylight over 100klx.

Original languageEnglish
Title of host publication2013 Symposium on VLSI Circuits, VLSIC 2013 - Digest of Technical Papers
PagesC6-C7
Publication statusPublished - 2013
Event2013 Symposium on VLSI Circuits, VLSIC 2013 - Kyoto, Japan
Duration: 2013 Jun 122013 Jun 14

Publication series

NameIEEE Symposium on VLSI Circuits, Digest of Technical Papers

Conference

Conference2013 Symposium on VLSI Circuits, VLSIC 2013
CountryJapan
CityKyoto
Period13/6/1213/6/14

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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