A compact switched beam-forming network using silicon IPD technology for low-cost 5G communication

Won Cheol Lee, Byung Wook Min, Choul Young Kim, Jun Chul Kim, Jong Min Yook

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

This paper introduces a compact and single-packaged beam forming network for a low-cost 5G transceiver system. For low-cost, silicon IPD (integrated passive device) is used to make the 4 × 4 Butler matrix and a switch IC is embedded in the silicon to make a single package structure and wire-bonding can be removed. The conventional branch line coupler is modified to minimize its size using MIM capacitors and short transmission lines. The measured result shows RMS magnitude errors are less than 0.96 dB and RMS phase errors are less than 10° at 28.7-30.6 GHz. Total area of the Butler matrix, pads not included, is 3 × 2.5 mm2 and the size of the final module including the switch IC is 6.7 × 3.3 × 0.1 mm3.

Original languageEnglish
Title of host publication2016 IEEE MTT-S International Microwave Symposium, IMS 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781509006984
DOIs
Publication statusPublished - 2016 Aug 9
Event2016 IEEE MTT-S International Microwave Symposium, IMS 2016 - San Francisco, United States
Duration: 2016 May 222016 May 27

Publication series

NameIEEE MTT-S International Microwave Symposium Digest
Volume2016-August
ISSN (Print)0149-645X

Other

Other2016 IEEE MTT-S International Microwave Symposium, IMS 2016
CountryUnited States
CitySan Francisco
Period16/5/2216/5/27

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All Science Journal Classification (ASJC) codes

  • Radiation
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

Cite this

Lee, W. C., Min, B. W., Kim, C. Y., Kim, J. C., & Yook, J. M. (2016). A compact switched beam-forming network using silicon IPD technology for low-cost 5G communication. In 2016 IEEE MTT-S International Microwave Symposium, IMS 2016 [7538229] (IEEE MTT-S International Microwave Symposium Digest; Vol. 2016-August). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MWSYM.2016.7538229