This paper introduces a compact and single-packaged beam forming network for a low-cost 5G transceiver system. For low-cost, silicon IPD (integrated passive device) is used to make the 4 × 4 Butler matrix and a switch IC is embedded in the silicon to make a single package structure and wire-bonding can be removed. The conventional branch line coupler is modified to minimize its size using MIM capacitors and short transmission lines. The measured result shows RMS magnitude errors are less than 0.96 dB and RMS phase errors are less than 10° at 28.7-30.6 GHz. Total area of the Butler matrix, pads not included, is 3 × 2.5 mm2 and the size of the final module including the switch IC is 6.7 × 3.3 × 0.1 mm3.
|Title of host publication||2016 IEEE MTT-S International Microwave Symposium, IMS 2016|
|Publisher||Institute of Electrical and Electronics Engineers Inc.|
|Publication status||Published - 2016 Aug 9|
|Event||2016 IEEE MTT-S International Microwave Symposium, IMS 2016 - San Francisco, United States|
Duration: 2016 May 22 → 2016 May 27
|Name||IEEE MTT-S International Microwave Symposium Digest|
|Other||2016 IEEE MTT-S International Microwave Symposium, IMS 2016|
|Period||16/5/22 → 16/5/27|
Bibliographical notePublisher Copyright:
© 2016 IEEE.
All Science Journal Classification (ASJC) codes
- Condensed Matter Physics
- Electrical and Electronic Engineering