A compact switched beam-forming network using silicon IPD technology for low-cost 5G communication

Won Cheol Lee, Byung Wook Min, Choul Young Kim, Jun Chul Kim, Jong Min Yook

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

This paper introduces a compact and single-packaged beam forming network for a low-cost 5G transceiver system. For low-cost, silicon IPD (integrated passive device) is used to make the 4 × 4 Butler matrix and a switch IC is embedded in the silicon to make a single package structure and wire-bonding can be removed. The conventional branch line coupler is modified to minimize its size using MIM capacitors and short transmission lines. The measured result shows RMS magnitude errors are less than 0.96 dB and RMS phase errors are less than 10° at 28.7-30.6 GHz. Total area of the Butler matrix, pads not included, is 3 × 2.5 mm2 and the size of the final module including the switch IC is 6.7 × 3.3 × 0.1 mm3.

Original languageEnglish
Title of host publication2016 IEEE MTT-S International Microwave Symposium, IMS 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
Volume2016-August
ISBN (Electronic)9781509006984
DOIs
Publication statusPublished - 2016 Aug 9
Event2016 IEEE MTT-S International Microwave Symposium, IMS 2016 - San Francisco, United States
Duration: 2016 May 222016 May 27

Other

Other2016 IEEE MTT-S International Microwave Symposium, IMS 2016
CountryUnited States
CitySan Francisco
Period16/5/2216/5/27

Fingerprint

Butler matrix
Beam forming networks
beamforming
switches
communication
Switches
MIM (semiconductors)
Silicon
phase error
Communication
transmitter receivers
silicon
matrices
Transceivers
couplers
transmission lines
Costs
Electric lines
capacitors
Capacitors

All Science Journal Classification (ASJC) codes

  • Radiation
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

Cite this

Lee, W. C., Min, B. W., Kim, C. Y., Kim, J. C., & Yook, J. M. (2016). A compact switched beam-forming network using silicon IPD technology for low-cost 5G communication. In 2016 IEEE MTT-S International Microwave Symposium, IMS 2016 (Vol. 2016-August). [7538229] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MWSYM.2016.7538229
Lee, Won Cheol ; Min, Byung Wook ; Kim, Choul Young ; Kim, Jun Chul ; Yook, Jong Min. / A compact switched beam-forming network using silicon IPD technology for low-cost 5G communication. 2016 IEEE MTT-S International Microwave Symposium, IMS 2016. Vol. 2016-August Institute of Electrical and Electronics Engineers Inc., 2016.
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abstract = "This paper introduces a compact and single-packaged beam forming network for a low-cost 5G transceiver system. For low-cost, silicon IPD (integrated passive device) is used to make the 4 × 4 Butler matrix and a switch IC is embedded in the silicon to make a single package structure and wire-bonding can be removed. The conventional branch line coupler is modified to minimize its size using MIM capacitors and short transmission lines. The measured result shows RMS magnitude errors are less than 0.96 dB and RMS phase errors are less than 10° at 28.7-30.6 GHz. Total area of the Butler matrix, pads not included, is 3 × 2.5 mm2 and the size of the final module including the switch IC is 6.7 × 3.3 × 0.1 mm3.",
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Lee, WC, Min, BW, Kim, CY, Kim, JC & Yook, JM 2016, A compact switched beam-forming network using silicon IPD technology for low-cost 5G communication. in 2016 IEEE MTT-S International Microwave Symposium, IMS 2016. vol. 2016-August, 7538229, Institute of Electrical and Electronics Engineers Inc., 2016 IEEE MTT-S International Microwave Symposium, IMS 2016, San Francisco, United States, 16/5/22. https://doi.org/10.1109/MWSYM.2016.7538229

A compact switched beam-forming network using silicon IPD technology for low-cost 5G communication. / Lee, Won Cheol; Min, Byung Wook; Kim, Choul Young; Kim, Jun Chul; Yook, Jong Min.

2016 IEEE MTT-S International Microwave Symposium, IMS 2016. Vol. 2016-August Institute of Electrical and Electronics Engineers Inc., 2016. 7538229.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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AB - This paper introduces a compact and single-packaged beam forming network for a low-cost 5G transceiver system. For low-cost, silicon IPD (integrated passive device) is used to make the 4 × 4 Butler matrix and a switch IC is embedded in the silicon to make a single package structure and wire-bonding can be removed. The conventional branch line coupler is modified to minimize its size using MIM capacitors and short transmission lines. The measured result shows RMS magnitude errors are less than 0.96 dB and RMS phase errors are less than 10° at 28.7-30.6 GHz. Total area of the Butler matrix, pads not included, is 3 × 2.5 mm2 and the size of the final module including the switch IC is 6.7 × 3.3 × 0.1 mm3.

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Lee WC, Min BW, Kim CY, Kim JC, Yook JM. A compact switched beam-forming network using silicon IPD technology for low-cost 5G communication. In 2016 IEEE MTT-S International Microwave Symposium, IMS 2016. Vol. 2016-August. Institute of Electrical and Electronics Engineers Inc. 2016. 7538229 https://doi.org/10.1109/MWSYM.2016.7538229