A design methodology to replicate the sub-micron land-groove structure in DVD-RAM substrates by injection-compression molding

Kibyung Seong, Su Dong Moon, Hyun Kim, Shinill Kang, Jun Seok Lee, Dongcheol Lee

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Recently, the sub-micron structured substrates of 0.74 μm track pitch and 800 Å groove depth are required for DVD-RAM, and the track pitch is expected to be narrower as the storage density for optical disk is getting higher. For the accurate replication of the land-groove structure in the stamper to the plastic substrates, it is important to control the injectioncompression molding process such that the integrity of the replication for the land-groove structure is maximized. However, the determination of the processing conditions has been relied on experience or trial-and-error. In the present study, polycarbonate substrates were fabricated by injection compression molding and the land-groove structure regarded as one of the most important geometrical properties for DVD-RAM substrates was measured. The effects of the mold temperature and the compression pressure on the integrity of the replication were examined experimentally. An efficient design methodology using the response surface method (RSM) and the central composite design (CCD) technique was developed to obtain the optimum processing conditions which maximize the integrity of the replication with a limited number of experiments. The model used in this study was verified using the analysis-of-variance (ANOVA), and it was found to be adequate within the confidence limit.

Original languageEnglish
Title of host publicationManufacturing Engineering
PublisherAmerican Society of Mechanical Engineers (ASME)
Pages1063-1069
Number of pages7
ISBN (Electronic)9780791819166
DOIs
Publication statusPublished - 2000
EventASME 2000 International Mechanical Engineering Congress and Exposition, IMECE 2000 - Orlando, United States
Duration: 2000 Nov 52000 Nov 10

Publication series

NameASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)
Volume2000-X

Conference

ConferenceASME 2000 International Mechanical Engineering Congress and Exposition, IMECE 2000
Country/TerritoryUnited States
CityOrlando
Period00/11/500/11/10

Bibliographical note

Funding Information:
This work was funded by the Korea Science and Engineering Foundation through CISD (1999G0102) at Yonsei University, and the authors are grateful for the support.

Publisher Copyright:
Copyright © 2000 by ASME.

All Science Journal Classification (ASJC) codes

  • Mechanical Engineering

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