A design of thin film thermoelectric cooler for Chip-on-Board(COB) assembly

Jung Ho Yoo, Hyun Ju Lee, Nam Jae Kim, Shi Ho Kim

Research output: Contribution to journalArticle

Abstract

A thin film thermoelectric cooler for COB direct assembly was proposed and the COB cooler structure was modeled by electrical equivalent circuit by using SPICE model of thermoelectric devices. The embedded cooler attached between the die chip and metal plate can offer the possibility of thin film active cooling for the COB direct assembly. We proposed a driving method of TEC by using pulse width modulation technique. The optimum power to the TEC is simulated by using a SPICE model of thermoelectric device and passive components representing thermal resistance and capacitance. The measured and simulated results offer the possibility of thin film active cooling for the COB direct assembly.

Original languageEnglish
Pages (from-to)1615-1620
Number of pages6
JournalTransactions of the Korean Institute of Electrical Engineers
Volume59
Issue number9
Publication statusPublished - 2010 Sep 1

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All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

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