A Framework for Architecture-Level Power, Area, Thermal Simulation and Its Application to Network-on-Chip Design Exploration

Ming Yu Hsieh, Arun F. Rodrigues, Rolf Riesen, Kevin Thompson, William Jinho Song

Research output: Contribution to journalArticle

Abstract

We describe the integrated power, area and thermal modeling framework in the Structural Simulation Toolkit (SST) for large-scale high performance computer simulation. It integrates various power and thermal modeling tools and computes run-time energy dissipation for core, network on chip, memory controller and shared cache. It also has functionality to update the leakage power as temperature changes. We illustrate the utilization of the framework by applying it to explore interconnect options in manycore systems with consideration of temperature variation and leakage feedback. We compare power, energy-delay-area product (EDAP), and energy-delay product (EDP) of four manycore configurations - 1 core, 2 cores, 4 cores and 8 cores per cluster. Results from simulation with or without consideration of temperature variation both show that the 4-core per cluster configuration has the best EDAP and EDP. Even so, considering temperature variation increases total power dissipation. We demonstrate the importance of considering temperature variation in the design flow. With this power, area and thermal modeling capability, SST can be used for hardware/software co-design of future Exascale systems.
Original languageEnglish
Pages (from-to)63-68
Number of pages6
JournalPerformance Evaluation Review
Volume38
Issue number4
Publication statusPublished - 2011 Mar

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